Recently, a lift-off-based patterning method using poor adhesion polymers such as parylene has been reported32. In this case, a perovskite film can be uniformly deposited since the surface energy is uniform throughout the entire prepatterned substrate. However, when removing the poor adhesion polymer from the substrate, a large stress is induced on the entire film, which can cause fractures or partial delamination of patterns32. In particular, these fractures or partial delamination of patterns can easily occur in high-efficiency perovskite PVs since perovskite films for high-efficiency PVs are usually formed through the surface passivation by adding excess lead iodide (PbI2)33 or two-dimensional (2D) perovskite materials34, which improves the properties but lowers the fracture energy of the perovskite films35,36. Therefore, a novel patterning method is required to fabricate uniform perovskite patterns for high-efficiency microcells that can lead to the high-performance colored solar windows.